Schmieding, M.; Holländer, U.; Möhwald, K.: Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature. In: IOP Conference Series: Materials Science and Engineering 181 (2017), Nr. 1, 12005. DOI:
https://doi.org/10.1088/1757-899X/181/1/012005
Abstract: |
Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.
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License of this version: |
CC BY 3.0 Unported - https://creativecommons.org/licenses/by/3.0/
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Publication type: |
Article |
Publishing status: |
publishedVersion |
Publication date: |
2017 |
Keywords english: |
Diffusion, Filler metals, Hot working, Melt spinning, Metal cladding, Remelting, Tin, Vacuum furnaces, Brazing temperature, Diffusion profiles, Hot working steels, Joining process, Line scan, Processing time, Pure Cu, Sn contents, Brazing
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DDC: |
530 | Physik
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Controlled keywords(GND): |
Konferenzschrift
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