Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature

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Schmieding, M.; Holländer, U.; Möhwald, K.: Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature. In: IOP Conference Series: Materials Science and Engineering 181 (2017), Nr. 1, 12005. DOI: https://doi.org/10.1088/1757-899X/181/1/012005

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Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.
License of this version: CC BY 3.0
Document Type: article
Publishing status: publishedVersion
Issue Date: 2017
Appears in Collections:Fakultät für Maschinenbau

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1 image of flag of Germany Germany 81 93.10%
2 image of flag of United States United States 2 2.30%
3 image of flag of Russian Federation Russian Federation 2 2.30%
4 image of flag of Korea, Republic of Korea, Republic of 1 1.15%
5 image of flag of China China 1 1.15%

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