Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature

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dc.identifier.uri http://dx.doi.org/10.15488/1420
dc.identifier.uri http://www.repo.uni-hannover.de/handle/123456789/1445
dc.contributor.author Schmieding, M.
dc.contributor.author Holländer, Ulrich
dc.contributor.author Möhwald, Kai
dc.date.accessioned 2017-04-28T08:05:15Z
dc.date.available 2017-04-28T08:05:15Z
dc.date.issued 2017
dc.identifier.citation Schmieding, M.; Holländer, U.; Möhwald, K.: Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature. In: IOP Conference Series: Materials Science and Engineering 181 (2017), Nr. 1, 12005. DOI: https://doi.org/10.1088/1757-899X/181/1/012005
dc.description.abstract Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications. eng
dc.description.sponsorship German Ministry of Economic Affairs and Energy
dc.description.sponsorship IGF/IGF 18.706 N/DVS
dc.language.iso eng
dc.publisher Bristol : Institute of Physics Publishing
dc.relation.ispartof 19th Chemnitz Seminar on Materials Engineering, March 16-17, 2017, Chemnitz, Germany
dc.relation.ispartofseries IOP Conference Series: Materials Science and Engineering 181 (2017), Nr. 1
dc.rights CC BY 3.0
dc.rights.uri https://creativecommons.org/licenses/by/3.0/
dc.subject Diffusion eng
dc.subject Filler metals eng
dc.subject Hot working eng
dc.subject Melt spinning eng
dc.subject Metal cladding eng
dc.subject Remelting eng
dc.subject Tin eng
dc.subject Vacuum furnaces eng
dc.subject Brazing temperature eng
dc.subject Diffusion profiles eng
dc.subject Hot working steels eng
dc.subject Joining process eng
dc.subject Line scan eng
dc.subject Processing time eng
dc.subject Pure Cu eng
dc.subject Sn contents eng
dc.subject Brazing eng
dc.subject.ddc 530 | Physik ger
dc.title Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature
dc.type article
dc.type conferenceObject
dc.type Text
dc.relation.issn 1757-8981
dc.relation.doi https://doi.org/10.1088/1757-899X/181/1/012005
dc.bibliographicCitation.issue 1
dc.bibliographicCitation.volume 181
dc.bibliographicCitation.firstPage 12005
dc.description.version publishedVersion
tib.accessRights frei zug�nglich


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