Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors

Jogschies, L.; Rittinger, J.; Klaas, D.; Wurz, M.C.

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dc.identifier.uri	http://dx.doi.org/10.15488/3249
dc.identifier.uri	http://www.repo.uni-hannover.de/handle/123456789/3279
dc.contributor.author	Jogschies, L.
dc.contributor.author	Rittinger, J.
dc.contributor.author	Klaas, D.
dc.contributor.author	Wurz, M.C.
dc.date.accessioned	2018-05-04T13:25:09Z
dc.date.available	2018-05-04T13:25:09Z
dc.date.issued	2016
dc.identifier.citation	Jogschies, L.; Rittinger, J.; Klaas, D.; Wurz, M.C.: Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors. In: Procedia Technology 26 (2016), S. 162-168. DOI: https://doi.org/10.1016/j.protcy.2016.08.022
dc.description.abstract	Flexible magnetic field sensors using the anisotropic magnetoresistive effect that have been developed within the Collaborative Research Center 653 are to be transferred into industrial applications. Occurring challenges result from interactions between the flexible polyimide substrate and the functional layer namely a thin NiFe 81/19 film deposited by a DC sputter process. We have optimized the DC sputter process with regard to stress and roughness reduction.	eng
dc.language.iso	eng
dc.publisher	Amsterdam : Elsevier
dc.relation.ispartofseries	Procedia Technology 26
dc.rights	CC BY-NC-ND 4.0 Unported
dc.rights.uri	https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subject	Flexible Substrate	eng
dc.subject	Collaborative Research Center 653	eng
dc.subject	stress in metallic thin films	eng
dc.subject.classification	Konferenzschrift	ger
dc.subject.ddc	600 \| Technik	ger
dc.title	Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors	eng
dc.type	Article
dc.type	Text
dc.relation.issn	2212-0173
dc.relation.doi	https://doi.org/10.1016/j.protcy.2016.08.022
dc.bibliographicCitation.volume	26
dc.bibliographicCitation.firstPage	162
dc.bibliographicCitation.lastPage	168
dc.description.version	publishedVersion
tib.accessRights	frei zug�nglich