Introducing pinhole magnification by selective etching: Application to poly-Si on ultra-thin silicon oxide films

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dc.identifier.uri http://dx.doi.org/10.15488/2638
dc.identifier.uri http://www.repo.uni-hannover.de/handle/123456789/2664
dc.contributor.author Tetzlaff, Dominic
dc.contributor.author Dzinnik, Marvin
dc.contributor.author Krügener, Jan
dc.contributor.author Larionova, Yevgeniya
dc.contributor.author Reiter, Sina
dc.contributor.author Turcu, Mircea
dc.contributor.author Peibst, Robby
dc.contributor.author Höhne, Uwe
dc.contributor.author Kähler, Jan-Dirk
dc.contributor.author Wietler, Tobias F.
dc.date.accessioned 2018-01-19T12:03:34Z
dc.date.available 2018-01-19T12:03:34Z
dc.date.issued 2017
dc.identifier.citation Tetzlaff, D.; Dzinnik, M.; Krügener, J.; Larionova, Y.; Reiter, S. et al.: Introducing pinhole magnification by selective etching: Application to poly-Si on ultra-thin silicon oxide films. In: Energy Procedia 124 (2017), S. 435-440. DOI: https://doi.org/10.1016/j.egypro.2017.09.270
dc.description.abstract Carrier selective junctions formed by polycrystalline silicon (poly-Si) on ultra-thin silicon oxide films are currently in the spotlight of silicon photovoltaics. We develop a simple method using selective etching and conventional optical microscopy to determine the pinhole density in interfacial oxide films of poly-Si on oxide (POLO)-junctions with excellent electrical properties. We characterize the selective etching of poly-Si versus ultra-thin silicon oxide. We use test structures with deliberately patterned openings and 3 nm thin oxide films to check the feasibility of magnification by undercutting the interfacial oxide. With the successful proof of our concept we introduce a new method to access the density of nanometer-size pinholes in POLO-junctions with excellent passivation properties. eng
dc.language.iso eng
dc.publisher Amsterdam : Elsevier
dc.relation.ispartofseries Energy Procedia 124 (2017)
dc.rights CC BY-NC-ND 4.0 Unported
dc.rights.uri https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subject carrier selective contacts eng
dc.subject pinholes eng
dc.subject polysilicon eng
dc.subject Tetramethylammonium hydroxide (TMAH) eng
dc.subject Etching eng
dc.subject Polycrystalline materials eng
dc.subject Polysilicon eng
dc.subject Silicon eng
dc.subject Silicon oxides eng
dc.subject Interfacial oxides eng
dc.subject Passivation properties eng
dc.subject pinholes eng
dc.subject Polycrystalline silicon (poly-Si) eng
dc.subject Selective contacts eng
dc.subject Selective etching eng
dc.subject Tetramethyl ammonium hydroxide eng
dc.subject Ultrathin silicon eng
dc.subject Oxide films eng
dc.subject.classification Konferenzschrift ger
dc.subject.ddc 530 | Physik ger
dc.title Introducing pinhole magnification by selective etching: Application to poly-Si on ultra-thin silicon oxide films
dc.type Article
dc.type Text
dc.relation.issn 18766102
dc.relation.doi https://doi.org/10.1016/j.egypro.2017.09.270
dc.bibliographicCitation.volume 124
dc.bibliographicCitation.firstPage 435
dc.bibliographicCitation.lastPage 440
dc.description.version publishedVersion
tib.accessRights frei zug�nglich


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