Browsing Fakultät für Elektrotechnik und Informatik by Subject "Packaging"

Browsing Fakultät für Elektrotechnik und Informatik by Subject "Packaging"

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  • Weide-Zaage, Kirsten; Payá-Vayá, Guillermo (Walnut, CA : ASTES Publishers, 2017)
    Radiation hardened devices are mostly extremely expensive. The continuously downscaling of microelectronic structures and the unavoidable presence of particle radiation on ground and in space leads to unwanted failures in ...

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