Influence of solder pads to PERC solar cells for module integration

Show simple item record

dc.identifier.uri Kiefer, Fabian Brendemühl, Till Berger, Miriam Lohse, Anja Kirstein, Sabine Braun, Nadja Lehr, Martin Heinemeyer, Frank Jung, Verena Morlier, Arnaud Blankemeyer, Susanne Kunze, Iris Winter, Renate Harder, Nils-Peter Dullweber, Thorsten Köntges, Marc Brendel, Rolf 2016-12-22T11:58:56Z 2016-12-22T11:58:56Z 2013
dc.identifier.citation Kiefer, F.; Brendemühl, T.; Berger, M.; Lohse, A.; Kirstein, S.; et al.: Influence of solder pads to PERC solar cells for module integration. In: Energy Procedia 38 (2013), S. 368-374. DOI:
dc.description.abstract The majority of screen printed solar cells has silver pads at the rear side to enable soldering for the module manufacturing. The pads increase the recombination at the silicon/metal interface due to the absence of a back surface field (BSF) at the solder pads. This reduces the efficiency of full-area Al-BSF solar cells. For passivated emitter and rear cells (PERC), a large area fraction of the rear side is covered with the passivation layer. When using specially designed Ag pastes for the rear side of PERC cells, the passivation of this layer is maintained, and the rear recombination is reduced. A comparison of solar cells with and without solder pads confirms that there is no loss in solar cell performance, both cell types achieve an efficiency of 19.6%. We investigate the influence of solder pads to PERC solar cells by calculating the effective rear surface recombination. The calculations confirm that there is a loss in open circuit voltage of less than 2 mV due to the solder pads. A 54-cell PERC PV module is manufactured. The cell-to-module loss reveals that the module process is still to be optimized. Comparable modules made from 9 solar cells lost less than 1% relative in all J-V parameters after a 1000h damp-heat test. eng
dc.description.sponsorship Heraeus Precious Materials
dc.language.iso eng
dc.publisher Amsterdam : Elsevier
dc.relation.ispartofseries Energy Procedia 38 (2013)
dc.rights CC BY-NC-ND 3.0 Unported
dc.subject Metallisation eng
dc.subject PERC eng
dc.subject PERC PV module eng
dc.subject Solar Cells eng
dc.subject Solder Pads eng
dc.subject.classification Konferenzschrift ger
dc.subject.ddc 600 | Technik ger
dc.subject.ddc 620 | Ingenieurwissenschaften und Maschinenbau ger
dc.subject.ddc 530 | Physik ger
dc.title Influence of solder pads to PERC solar cells for module integration
dc.type article
dc.type Text
dc.relation.issn 18766102
dc.bibliographicCitation.volume 38
dc.bibliographicCitation.firstPage 368
dc.bibliographicCitation.lastPage 374
dc.description.version publishedVersion
tib.accessRights frei zug�nglich

Files in this item

This item appears in the following Collection(s):

Show simple item record


Search the repository


My Account

Usage Statistics