Influence of Encapsulation Process Temperature on the Performance of Perovskite Mini Modules

Abstract

Perovskite-on-silicon tandem solar cells are a promising candidate to significantly increase the efficiency of PV modules. Despite the fast research progress on material and solar cells aspects, there is still a lack of processes for an industrial module integration of these devices. One aspect hereby is the adaption of encapsulation materials and processes to the requirements of perovskite materials. Process temperatures of about 150 °C are necessary to use well proven, in silicon PV commonly applied encapsulation materials with a high reliability. However, perovskites start to decompose into their components at high temperatures. This limits the encapsulation process temperature, which in turn constraints the choice of encapsulation materials. This work presents an encapsulation process for methylammonium lead iodide (MAPhb) single junction perovskite solar cells (PSCs) with conventional production tools in glass-glass modules that serves as a model system for perovskite tandem applications. We evaluate the influence of the encapsulation process temperature between 120 °C and 160 °C on the performance of mini modules. The UV-absorbing encapsulation material is processable over the whole investigated temperature regime. We observe a difference in the IV-characteristics between the PSCs encapsulated in the temperature range of 120 °C - 140 °C to those processed at 160 °C. At lower encapsulation temperatures the IV-curves taken 1 h after encapsulation show a pronounced S-shape and no degradation of Foe. In contrast, the PSCs encapsulated at 160 °C exhibit a Foe decrease of up to 29% compared to the initial measurement shortly after PSC fabrication and no significant S-shape. Both, the S-shape that occurs at low encapsulation temperatures and the Foe loss after encapsulation at 160 °C, are no longer significant after one week of module storage under dark conditions. The presented encapsulation process therefore does not permanently damage the MAPbb PSCs even at a standard encapsulation temperature of 160 °C. To ensure long-term operation, we test the fabricated mini modules in a damp heat test at 85 °C and a relative humidity of 85%. We find no significant additional degradation caused by damp heat in 1250 h test duration compared to a reference module stored in ambient air.