Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives

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dc.identifier.uri Geipel, Torsten Rendler, Li Carlos Stompe, Manuel Eitner, Ulrich Rissing, Lutz 2016-11-30T08:58:10Z 2016-11-30T08:58:10Z 2015
dc.identifier.citation Geipel, T.; Rendler, L.C.; Stompe, M.; Eitner, U.; Rissing, L.: Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives. In: Energy Procedia 77 (2015), S. 346-355. DOI: 10.1016/j.egypro.2015.07.049
dc.description.abstract We compare the thermomechanical stresses in solar cell interconnections based on electrically conductive adhesives (ECA) with soldered joints by using bending experiments and finite element analysis (FEA). Additionally, the influence of an increasing number of busbars is studied. The FEA is validated by measuring the bending of cell strips after cooling down from a single-sided interconnection process. The material parameters are determined by tensile tests, microscopy and nanoindentation. The comparison of ECA and soldering shows that an elastomer with a Young's modulus of below 0.5 GPa is capable of reducing the thermomechanical stress effectively resulting in, approximately, a mean tensile stress in the ECA of 5 MPa, 110 MPa in the ribbon, and a maximum compressive stress in the silicon of 75 MPa. Increasing the number of busbars from three to five leads to a reduction in compressive stresses in the silicon and a slight increase of the peak tensile stress in the busbars. eng
dc.language.iso eng
dc.publisher Amsterdam : Elsevier
dc.relation.ispartof Energy Procedia 77 (2015)
dc.relation.ispartofseries Energy Procedia
dc.rights CC BY-NC-ND 4.0
dc.subject Electrically Conductive Adhesives eng
dc.subject Finite Element Model eng
dc.subject Interconnection eng
dc.subject Photovoltaic Module eng
dc.subject Thermomechanical Stress eng
dc.subject Adhesives eng
dc.subject Busbars eng
dc.subject Elastic moduli eng
dc.subject Electric power system interconnection eng
dc.subject Finite element method eng
dc.subject Photovoltaic cells eng
dc.subject Silicon eng
dc.subject Tensile stress eng
dc.subject Tensile testing eng
dc.subject Bending experiments eng
dc.subject Cell interconnection eng
dc.subject Electrically conductive adhesives eng
dc.subject Interconnection eng
dc.subject Material parameter eng
dc.subject Photovoltaic modules eng
dc.subject Thermo-mechanical stress eng
dc.subject Compressive stress eng
dc.subject.ddc 500 | Naturwissenschaften ger
dc.subject.ddc 530 | Physik ger
dc.title Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives
dc.type article
dc.type conferenceObject
dc.type Text
dc.relation.issn 1876-6102
dc.relation.doi 10.1016/j.egypro.2015.07.049
dc.bibliographicCitation.volume 77
dc.bibliographicCitation.firstPage 346
dc.bibliographicCitation.lastPage 355
dc.description.version publishedVersion
tib.accessRights frei zug�nglich

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