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Experimental Investigation of the Rapid Fabrication of Micron and Submicron Structures on Polymers Utilizing Ultrasonic Assisted Embossing
Zhu, Yongyong
;
Bengsch, Sebastian
;
Zheng, Lei
;
Long, Yangyang
;
Roth, Bernhard Wilhelm
;
Wurz, Marc Christopher
;
Twiefel, Jens
;
Wallaschek, Jörg
(
Basel : MDPI
,
2021
)
Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Long, Yangyang
;
He, Bo
;
Cui, Weizhe
;
Ji, Yuhang
;
Zhuang, Xiaoying.
;
Twiefel, Jens
(
Amsterdam : Elsevier Ltd
,
2020
)
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Usage Statistics
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Author
Long, Yangyang (2)
Twiefel, Jens (2)
Bengsch, Sebastian (1)
Cui, Weizhe (1)
He, Bo (1)
Ji, Yuhang (1)
Roth, Bernhard Wilhelm (1)
Wallaschek, Jörg (1)
Wurz, Marc Christopher (1)
Zheng, Lei (1)
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Subject
Bonding mechanism (1)
Bonding process (1)
Control strategies (1)
Displacement patterns (1)
Embossing (1)
Impedance-based control (1)
Interface structures (1)
Joining (1)
Joining technology (1)
Keywords: ultrasonic vibration (1)
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Date Issued
2021 (1)
2020 (1)
Language (ISO)
eng (2)