In recent years, the number of patients with orthopedic diseases such as cervical spondylosis has increased, resulting in an increase in the demand for orthopedic surgery. However, thermal necrosis and bone cracks caused ...

Due to the complex mechanisms, the ultrasonic (US) wire bonding process is usually optimized in the way of varying the processing parameters including normal force, US power, and processing time. In this study, a new way ...

Ultrasonic (US) wire bonding is a predominating interconnection technique in the microelectronic packaging industry. Despite its long-term usage and wide applications, the mechanisms, especially those of the friction and ...