Long-term stable encapsulated solder joints on an Al/Ni:V/Ag metallization for silicon solar cells

Show simple item record

dc.identifier.uri http://dx.doi.org/10.15488/4489
dc.identifier.uri https://www.repo.uni-hannover.de/handle/123456789/4529
dc.contributor.author Jung, Verena
dc.contributor.author Heinemeyer, Frank
dc.contributor.author Köntges, Marc
dc.date.accessioned 2019-03-06T09:48:59Z
dc.date.available 2019-03-06T09:48:59Z
dc.date.issued 2011
dc.identifier.citation Jung, V.; Heinemeyer, F.; Köntges, M.: Long-term stable encapsulated solder joints on an Al/Ni:V/Ag metallization for silicon solar cells. In: Energy Procedia 21 (2011), S. 84-91. DOI: https://doi.org/10.1016/j.egypro.2012.05.011
dc.description.abstract Evaporated Al as metallization for silicon solar cells may be profitable as it requires less Al material than the common screen-printed Al/Ag-paste combinations and forms contacts with a lower contact resistivity. To achieve solderability a sputter deposited Ni:V and an Ag layer are deposited onto the evaporated Al layer. Tin-coated Cuconnectors with a lead-free and a lead-containing solder are employed in combination with two halogen-free no-clean fluxes with varying solid contents. The long-term solderability of the metallization stack is demonstrated by comparing 180° peel forces (DIN EN 50461) of Cu-connectors soldered onto the metallization stack directly after preparation, after accelerated storing following IPC J-STD-003B and after storing for half a year at room temperature. The long-term stability of the solder joints is verified by measuring the normalized contact resistivity and by a visual inspection of encapsulated samples during a damp heat test (DIN EN 61215). For encapsulation an EVA foil and a silicone elastomer are used as encapsulation materials. As the lead-containing solder does not adhere sufficiently after accelerated aging, the flux with high contend of solids may accelerate corrosion and the EVA laminates exhibit adhesion problems between the samples and the lamination foil. The lead-free solder and the flux with the lower solid content in a silicone elastomer based laminate emerge to be the most promising candidates for a long term stable interconnection of Al/Ni:V/Ag metallized solar cells. eng
dc.language.iso eng
dc.publisher London : Elsevier Ltd.
dc.relation.ispartofseries Energy Procedia 21 (2011)
dc.rights CC BY-NC-ND 3.0 Unported
dc.rights.uri https://creativecommons.org/licenses/by-nc-nd/3.0/
dc.subject Crystalline silicon eng
dc.subject Evaporation eng
dc.subject Laminate eng
dc.subject Long-term stable eng
dc.subject Metallization eng
dc.subject Solar cell eng
dc.subject Solder joint eng
dc.subject Sputtering eng
dc.subject.classification Konferenzschrift ger
dc.subject.ddc 620 | Ingenieurwissenschaften und Maschinenbau ger
dc.title Long-term stable encapsulated solder joints on an Al/Ni:V/Ag metallization for silicon solar cells
dc.type Article
dc.type Text
dc.relation.issn 1876-6102
dc.relation.doi https://doi.org/10.1016/j.egypro.2012.05.011
dc.bibliographicCitation.volume 21
dc.bibliographicCitation.firstPage 84
dc.bibliographicCitation.lastPage 91
dc.description.version publishedVersion
tib.accessRights frei zug�nglich

Files in this item

This item appears in the following Collection(s):

  • An-Institute
    Frei zugängliche Publikationen aus An-Instituten der Leibniz Universität Hannover

Show simple item record


Search the repository


My Account

Usage Statistics