Analysis of ESD induced field coupling due to improper contact between PCB ground and metal housing

Abstract

Electrostatic Discharge (ESD) poses a significant challenge to the reliability of Devices Under Test (DUTs) within the automotive industry. ESD Power-On Tests are essential to assess how well DUTs can withstand real world ESD events. When designing a DUT for ESD immunity, designer must take care of 1. Direct Conduction: This involves ESD discharges flowing through DUT circuitry, which can potentially lead to permanent damage or performance deterioration. 2. Induced Field Coupling: ESD discharges generate electric and magnetic fields that can couple with nearby sensitive circuits, causing soft errors [1] by inducing voltage or current in these circuits[2]. This paper discusses the influence of Transient Electromagnetic (TEM) coupling on sensitive circuits, which can occur due to high-impulse surface currents generated by ESD events, resulting from improper contact between the Printed Circuit Board (PCB) ground and metal housing.