In-Process Laser Scanning Technology for Micro Assembly

Loading...
Thumbnail Image
Date
2007
Volume
2
Issue
Journal
Series Titel
Book Title
Proceedings of the 7th international conference / European Society for Precision Engineering and Nanotechnology : May 20th - May 24th 2007, Bremen, Germany, Vol. 2
Publisher
Bedford : Euspen (European Society for Precision Engineering and Nanotechnology)
Link to publishers version
Abstract

To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-infonnation of micro components and a proposal of the field of application is outlined.

Description
Keywords
License
Es gilt deutsches Urheberrecht. Das Dokument darf zum eigenen Gebrauch kostenfrei genutzt, aber nicht im Internet bereitgestellt oder an Außenstehende weitergegeben werden.