Layer selective laser ablation for local contacts to thin emitters

Abstract

High efficiency solar cells require high generation and low recombination rates. High bulk lifetime, well passivated surfaces, and lowly doped thin emitters allow for low recombination rates. Thin passivated emitters should be contacted locally in order to avoid excessive contact recombination. This is common practice for front junction solar cells but is also advantageous for back junction cells. We analyze a novel layer selective laser ablation process. From a passivating stack composed of 70 nm silicon nitride that we deposit on top of 35 nm of amorphous silicon we selectively ablate the silicon nitride layer. Transmission electron microscopy investigations confirm the full ablation of the silicon nitride layer. After the ablation process, a 17 nm-thick amorphous silicon layer remains on the substrate. The crystalline silicon substrate shows no dislocations after the process. Evaporating aluminum on top of the locally ablated nitride layers forms local contacts of the aluminum to the silicon.