Laser processing of thin glass printed circuit boards with a picosecond laser at 515 nm wavelength

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Plat, K.; Witzendorff, P.V.; Suttmann, O.; Overmeyer, L.: Laser processing of thin glass printed circuit boards with a picosecond laser at 515 nm wavelength. In: Physics Procedia 56 (2014), S. 983-990. DOI:

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Sum total of downloads: 86

High temperature applications of printed circuit boards (PCB) require materials with specifically adapted properties. Hence, conventional electrically isolating glass fiber and epoxy-resin materials have to be replaced by thin borosilicate glass. Therefore, an industrially suitable process to remove the metal coatings from the brittle thin glass has to be developed. Laser processing has the advantage of individualization for the production of customer-specific PCBs. Thus, laser ablation of metal coatings for electrical isolation is investigated with different material composites based on thin glass. The study aims to identify a laser process for a picosecond laser source with 515 nm wavelength to perform the process without damaging the glass substrate with a high throughput.
License of this version: CC BY-NC-ND 3.0 Unported
Document Type: Article
Publishing status: publishedVersion
Issue Date: 2014
Appears in Collections:An-Institute

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pos. country downloads
total perc.
1 image of flag of Germany Germany 47 54.65%
2 image of flag of United States United States 18 20.93%
3 image of flag of China China 4 4.65%
4 image of flag of No geo information available No geo information available 3 3.49%
5 image of flag of Hong Kong Hong Kong 3 3.49%
6 image of flag of Canada Canada 2 2.33%
7 image of flag of Austria Austria 2 2.33%
8 image of flag of Latvia Latvia 1 1.16%
9 image of flag of India India 1 1.16%
10 image of flag of Ireland Ireland 1 1.16%
    other countries 4 4.65%

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