In precision assembly, the cost of machine technology increases significantly when high assembly accuracyis required (<15 µm). One reason is that higher accuracy with conventional automation technology requiresmuch more precise and expensive machine components, such as bearings and actuators. Electrostatic selfassembly is a technique for the automatic alignment of micro-components without the need for precisemachines and thus has the potential to reduce fabrication costs significantly. With this technique, electrodesare placed on the micro-components and the substrate. A low viscosity fluid is applied to the substrate andthe components are roughly positioned. One pair of electrodes on the component faces one pair of electrodeson the substrate, equivalent to plate capacitors connected in series. If an alternating voltage is applied to thesubstrate electrodes, an electric field is formed. This results in electrostatic attraction in the transversal andlateral direction, which leads to an alignment of the components on the substrate. In this paper, we describethe structure design process for electrostatic self-assembly. Instead of micro-components, we use arectangular glass wafer with a length of 125 mm. Within two test series, we prove that the existing techniqueis also suitable for a larger scale.