Veith, Boris; Dullweber, Thorsten; Siebert, M.; Kranz, Christopher; Werner, Florian; Harder, Nils-Peter; Schmidt, Jan; Roos, B.F.P.; Dippell, T.; Brendel, Rolf
(Amsterdam : Elsevier BV, 2012)
The deposition rate of the standard (i.e. sequential) atomic layer deposition (ALD) process is very low compared to the plasma-enhanced chemical vapour deposition (PECVD) process. Therefore, as a short- and medium-term ...