Long, Yangyang; He, Bo; Cui, Weizhe; Ji, Yuhang; Zhuang, Xiaoying.; Twiefel, Jens
(Amsterdam : Elsevier Ltd, 2020)
Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US metal joining technologies, the mechanism of microweld changes during the bonding process, including formation, deformation and ...