Browsing by Subject "Module integration"

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  • Schulte-Huxel, Henning; Witteck, Robert; van Laak, Paula; Brendemühl, Till; Hinken, David; Bothe, Karsten; Brendel, Rolf (London : Elsevier Ltd., 2016)
    Screen-printed passivated emitter and rear cells (PERC) require Ag pads on the rear side to enable solderable connections for module integration. These Ag pads are separated from the silicon by a dielectric layer to avoid ...
  • Schulte-Huxel, Henning; Blankemeyer, Susanne; Steckenreiter, Verena; Kajari-Schröder, Sarah; Brendel, Rolf (Amsterdam : Elsevier, 2014)
    We demonstrate the laser welding of Al interconnects to the BSF rear-side of screen-printed two-side-contacted solar cells. The Al paste on the rear side of solar cell is laser-welded to an Al foil. This reduces the silver ...
  • Schulte-Huxel, Henning; Römer, Udo; Blankemeyer, Susanne; Merkle, Agnes; Larionova, Yevgeniya; Steckenreiter, Verena; Peibst, Robby; Kajari-Schröder, Sarah; Brendel, Rolf (Amsterdam : Elsevier, 2014)
    We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is ...