Browsing by Subject "Kerf-free"

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  • Niepelt, Raphael; Hensen, Jan; Knorr, Alwina; Steckenreiter, Verena; Kajari-Schröder, Sarah; Brendel, Rolf (Amsterdam : Elsevier, 2014)
    Kerfless wafering techniques offer a significant cost saving potential via the reduction of silicon consumption. In this paper, we examine thin single crystalline Si foils that were fabricated by a novel kerfless ...
  • Schäfer, Sören; Ernst, Marco; Kajari-Schröder, Sarah; Brendel, Rolf (Amsterdam : Elsevier, 2013)
    Kerf-free techniques for subdividing a single thick crystalline Si wafer into a multitude of thin Si layers have a large potential for cost reductions. In this paper, we explore pore formation in Si for separating many 18 ...
  • Ernst, Marco; Schulte-Huxel, Henning; Niepelt, Raphael; Kajari-Schröder, Sarah; Brendel, Rolf (Amsterdam : Elsevier, 2013)
    We separate a (34 ± 2) μm-thick macroporous Si layer from an n-type Si wafer by means of electrochemical etching. The porosity is p = (26.2 ± 2.4)%. We use ion implantation to selectively dope the outer surfaces of the ...