Assessing the stability of p+ and n+ polysilicon passivating contacts with various capping layers on p-type wafers

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dc.identifier.uri http://dx.doi.org/10.15488/15498
dc.identifier.uri https://www.repo.uni-hannover.de/handle/123456789/15619
dc.contributor.author Madumelu, Chukwuka
dc.contributor.author Cai, Yalun
dc.contributor.author Hollemann, Christina
dc.contributor.author Peibst, Robby
dc.contributor.author Hoex, Bram
dc.contributor.author Hallam, Brett J.
dc.contributor.author Soeriyadi, Anastasia H.
dc.date.accessioned 2023-11-24T05:59:02Z
dc.date.available 2023-11-24T05:59:02Z
dc.date.issued 2023
dc.identifier.citation Madumelu, C.; Cai, Y.; Hollemann, C.; Peibst, R.; Hoex, B. et al.: Assessing the stability of p+ and n+ polysilicon passivating contacts with various capping layers on p-type wafers. In: Solar Energy Materials and Solar Cells 253 (2023), 112245. DOI: https://doi.org/10.1016/j.solmat.2023.112245
dc.description.abstract Polysilicon (poly-Si)-on-oxide passivating contact structures (POLO/TOPCon) enable high-efficiency solar cells as they simultaneously provide a very high level of surface passivation and a high conductance for either electrons or holes. The ease of incorporation with existing manufacturing lines and their tolerance for high-temperature processing has increased the wide acceptance of this structure in the PV industry. In this report, we explore the effects of short high-temperature annealing required for effective hydrogenation and formation of ohmic screen-printed contacts across a wide temperature range (636 °C–846 °C) on the stability of passivating contact structures. We study this on p-type c-Si substrates with phosphorus-doped (n-type) or boron-doped (p-type) polysilicon contacts capped with either an AlOx or SiNx coating. Our experimental results show that irrespective of the poly-Si doping type, AlOx-capped samples suffer a loss in surface passivation across the investigated temperature range, while SiNx-capped samples show an improvement at lower annealing temperatures. Above 744 °C, severely ruptured blisters occur for the samples coated with a SiNx layer, leading to lift-off of the poly layer in extreme cases, and in all cases, significant surface passivation losses, up to 99%. A study of the long-term stability of these fired samples under 1-sun illumination @ 140 °C shows that they suffer from both bulk and surface-like instabilities. Two degradation cycles were observed: the first, a boron-oxygen light-induced degradation (BO-LID) observed after 5 min, with capture cross-section ratios of 15.8–19.2, and a slower secondary degradation, similar to light and elevated temperature-induced degradation (LeTID), with maximum degradation reached after ∼ 14 days. The presence of a silicon nitride layer does not appear to influence the kinetics of post-degradation recovery. Our results suggest that the effect of firing may be influenced by the polarity of the bulk c-Si or perhaps the chemistry of the SiNx film and highlight that passivating contact structures based on p-type c-Si may offer better long-term stability than those based on n-type c-Si. eng
dc.language.iso eng
dc.publisher Amsterdam [u.a.] : NH, Elsevier
dc.relation.ispartofseries Solar Energy Materials and Solar Cells 253 (2023)
dc.rights CC BY 4.0 Unported
dc.rights.uri https://creativecommons.org/licenses/by/4.0
dc.subject Aluminum compounds eng
dc.subject Boron eng
dc.subject Passivation eng
dc.subject Polycrystalline materials eng
dc.subject Semiconductor doping eng
dc.subject Silicon nitride eng
dc.subject Silicon wafers eng
dc.subject Stability eng
dc.subject.ddc 530 | Physik
dc.subject.ddc 620 | Ingenieurwissenschaften und Maschinenbau
dc.title Assessing the stability of p+ and n+ polysilicon passivating contacts with various capping layers on p-type wafers eng
dc.type Article
dc.type Text
dc.relation.issn 0927-0248
dc.relation.doi https://doi.org/10.1016/j.solmat.2023.112245
dc.bibliographicCitation.volume 253
dc.bibliographicCitation.firstPage 112245
dc.description.version publishedVersion eng
tib.accessRights frei zug�nglich
dc.bibliographicCitation.articleNumber 112245


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