Additive manufacturing of copper vertical interconnect accesses by laser processing

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Overmeyer, L.; Olsen, E.; Hoffmann, G.-A.: Additive manufacturing of copper vertical interconnect accesses by laser processing. In: CIRP Annals 70 (2021), Nr. 1, S. 163-166. DOI: https://doi.org/10.1016/j.cirp.2021.03.006

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Sum total of downloads: 88




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Abstract: 
This paper introduces a new manufacturing process for vertical interconnect accesses (VIA). In contrast to industrially established VIA metallization technologies, the presented approach takes place without any chemical plating by combining copper ink and epoxy insulator coating with CO2 laser processing for VIA drilling and copper ink sintering. The minimum VIA resistances are less than 50 mΩ, fitting the theoretically calculated value. A laboratory application scenario testing a 10 × 10 contact pad array with a pitch of 800 µm successfully demonstrates routing across five printed metallization layers, including 128 blind and 112 buried VIA. © 2021 The Authors
License of this version: CC BY 4.0 Unported
Document Type: Article
Publishing status: publishedVersion
Issue Date: 2021
Appears in Collections:Fakultät für Maschinenbau

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pos. country downloads
total perc.
1 image of flag of Germany Germany 42 47.73%
2 image of flag of United States United States 18 20.45%
3 image of flag of China China 8 9.09%
4 image of flag of Czech Republic Czech Republic 5 5.68%
5 image of flag of Israel Israel 3 3.41%
6 image of flag of Hong Kong Hong Kong 2 2.27%
7 image of flag of United Kingdom United Kingdom 2 2.27%
8 image of flag of Taiwan Taiwan 1 1.14%
9 image of flag of Sweden Sweden 1 1.14%
10 image of flag of Russian Federation Russian Federation 1 1.14%
    other countries 5 5.68%

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