Käsewieter, Jörg; Kajari-Schröder, Sarah; Niendorf, Thomas; Brendel, Rolf
(Amsterdam : Elsevier, 2013)
Ultra-thin silicon wafer have to withstand forces and stresses during handling procedures without breakage. Here we investigate the failure stresses of ?30 ?m thick monocrystalline silicon films produced with the porous ...