dc.identifier.uri |
http://dx.doi.org/10.15488/1755 |
|
dc.identifier.uri |
http://www.repo.uni-hannover.de/handle/123456789/1780 |
|
dc.contributor.author |
Akin, Meriem
|
|
dc.contributor.author |
Rezem, Maher
|
|
dc.contributor.author |
Rahlves, Maik
|
|
dc.contributor.author |
Cromwell, Kevin
|
|
dc.contributor.author |
Roth, Bernhard
|
|
dc.contributor.author |
Reithmeier, Eduard
|
|
dc.contributor.author |
Wurz, Marc Christopher
|
|
dc.contributor.author |
Rissing, Lutz
|
|
dc.contributor.author |
Maier, Hans Jürgen
|
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dc.date.accessioned |
2017-08-08T08:49:49Z |
|
dc.date.available |
2017-08-08T08:49:49Z |
|
dc.date.issued |
2016 |
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dc.identifier.citation |
Akin, M.; Rezem, M.; Rahlves, M.; Cromwell, K.; Roth, B. et al.: Direct hot embossing of microelements by means of photostructurable polyimide. In: Journal of Micro/ Nanolithography, MEMS, and MOEMS 15 (2016), Nr. 3, 34506. DOI: https://doi.org/10.1117/1.JMM.15.3.034506 |
|
dc.description.abstract |
While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns. © 2016 Society of Photo-Optical Instrumentation Engineers (SPIE). |
eng |
dc.description.sponsorship |
DFG/CRC/Planar Optronic Systems |
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dc.language.iso |
eng |
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dc.publisher |
Bellingham, WA : S P I E - International Society for Optical Engineering |
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dc.relation.ispartofseries |
Journal of Micro/ Nanolithography, MEMS, and MOEMS 15 (2016), Nr. 3 |
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dc.rights |
Es gilt deutsches Urheberrecht. Das Dokument darf zum eigenen Gebrauch kostenfrei genutzt, aber nicht im Internet bereitgestellt oder an Außenstehende weitergegeben werden. Dieser Beitrag ist aufgrund einer (DFG-geförderten) Allianz- bzw. Nationallizenz frei zugänglich. |
|
dc.subject |
fluidic systems |
eng |
dc.subject |
hot embossing |
eng |
dc.subject |
optical devices |
eng |
dc.subject |
polyimide |
eng |
dc.subject |
stamp fabrication |
eng |
dc.subject |
stamp reliability |
eng |
dc.subject |
Electroplating |
eng |
dc.subject |
Light sensitive materials |
eng |
dc.subject |
Optical devices |
eng |
dc.subject |
Polyimides |
eng |
dc.subject |
Silicones |
eng |
dc.subject |
Fluidic systems |
eng |
dc.subject |
Hot-embossing |
eng |
dc.subject |
Microstructural patterns |
eng |
dc.subject |
Molding techniques |
eng |
dc.subject |
Photo-sensitive polyimide |
eng |
dc.subject |
Photoresist patterns |
eng |
dc.subject |
Polymeric devices |
eng |
dc.subject |
Small-scale production |
eng |
dc.subject |
Photoresists |
eng |
dc.subject.ddc |
530 | Physik
|
ger |
dc.title |
Direct hot embossing of microelements by means of photostructurable polyimide |
eng |
dc.type |
Article |
|
dc.type |
Text |
|
dc.relation.issn |
1932-5150 |
|
dc.relation.doi |
https://doi.org/10.1117/1.JMM.15.3.034506 |
|
dc.bibliographicCitation.issue |
3 |
|
dc.bibliographicCitation.volume |
15 |
|
dc.bibliographicCitation.firstPage |
34506 |
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dc.description.version |
publishedVersion |
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tib.accessRights |
frei zug�nglich |
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