Introducing pinhole magnification by selective etching: Application to poly-Si on ultra-thin silicon oxide films

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Tetzlaff, D.; Dzinnik, M.; Krügener, J.; Larionova, Y.; Reiter, S. et al.: Introducing pinhole magnification by selective etching: Application to poly-Si on ultra-thin silicon oxide films. In: Energy Procedia 124 (2017), S. 435-440. DOI: https://doi.org/10.1016/j.egypro.2017.09.270

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Abstract: 
Carrier selective junctions formed by polycrystalline silicon (poly-Si) on ultra-thin silicon oxide films are currently in the spotlight of silicon photovoltaics. We develop a simple method using selective etching and conventional optical microscopy to determine the pinhole density in interfacial oxide films of poly-Si on oxide (POLO)-junctions with excellent electrical properties. We characterize the selective etching of poly-Si versus ultra-thin silicon oxide. We use test structures with deliberately patterned openings and 3 nm thin oxide films to check the feasibility of magnification by undercutting the interfacial oxide. With the successful proof of our concept we introduce a new method to access the density of nanometer-size pinholes in POLO-junctions with excellent passivation properties.
License of this version: CC BY-NC-ND 4.0 Unported
Document Type: Article
Publishing status: publishedVersion
Issue Date: 2017
Appears in Collections:Fakultät für Elektrotechnik und Informatik

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1 image of flag of Germany Germany 222 53.37%
2 image of flag of United States United States 61 14.66%
3 image of flag of Korea, Republic of Korea, Republic of 23 5.53%
4 image of flag of China China 23 5.53%
5 image of flag of Taiwan Taiwan 22 5.29%
6 image of flag of Czech Republic Czech Republic 12 2.88%
7 image of flag of Japan Japan 6 1.44%
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10 image of flag of Canada Canada 3 0.72%
    other countries 37 8.89%

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