Concept of a bonding technology for dies below 150 micrometers

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Gottwald, S.N.; Reitz, B.; Albrecht, D.; Overmeyer, L.: Concept of a bonding technology for dies below 150 micrometers. In: Procedia Manufacturing 52 (2020), S. 9-13. DOI: https://doi.org/10.1016/j.promfg.2020.11.003

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To cite the version in the repository, please use this identifier: https://doi.org/10.15488/15982

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Sum total of downloads: 31




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Abstract: 
Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.
License of this version: CC BY-NC-ND 4.0 Unported
Document Type: Article
Publishing status: publishedVersion
Issue Date: 2020
Appears in Collections:Fakultät für Maschinenbau
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pos. country downloads
total perc.
1 image of flag of Germany Germany 18 58.06%
2 image of flag of United States United States 4 12.90%
3 image of flag of Russian Federation Russian Federation 3 9.68%
4 image of flag of Israel Israel 3 9.68%
5 image of flag of Malaysia Malaysia 1 3.23%
6 image of flag of Europe Europe 1 3.23%
7 image of flag of Czech Republic Czech Republic 1 3.23%

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