Self-optimizing process planning of multi-step polishing processes

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Denkena, B.; Dittrich, M.-A.; Nguyen, H.N.; Bild, K.: Self-optimizing process planning of multi-step polishing processes. In: Production Engineering 15 (2021), Nr. 3-4, S. 563-571. DOI: https://doi.org/10.1007/s11740-021-01042-6

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Sum total of downloads: 36




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Abstract: 
Self-optimizing process planning is an essential approach for finding optimum process parameters and reducing ramp-up times in machining processes. For this purpose, polishing is presented as an application example. In conventional polishing processes, the process parameters are selected according to the operator’s expertise in order to achieve a high-quality surface in the final production step. By implementing machine learning (ML) models in process planning, a correlation between process parameter and measured surface quality is generated. The application of this knowledge automates the selection of optimal process parameters in computer-aided manufacturing (CAM) and enables a continuous adaptation of the NC-code to changing process conditions. Applying the presented ML-model, the prediction accuracy of 83% will adapt the process parameters to achieve the target roughness of 0.2 μm. The sample efficiency is shown by the decrease in root mean square error from 0.1–0.28 to 0.02–0.07 μm with additional polishing iterations.
License of this version: CC BY 4.0 Unported
Document Type: Article
Publishing status: publishedVersion
Issue Date: 2021
Appears in Collections:Fakultät für Maschinenbau

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pos. country downloads
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1 image of flag of Germany Germany 28 77.78%
2 image of flag of United States United States 4 11.11%
3 image of flag of Indonesia Indonesia 2 5.56%
4 image of flag of South Africa South Africa 1 2.78%
5 image of flag of Iran, Islamic Republic of Iran, Islamic Republic of 1 2.78%

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